Parker Unveils Next Generation of Thermal Gap Filler Pads

Parker Unveils Next Generation of High-Performance Thermal Gap Filler Pads

The new THERM-A-GAPTM PAD 30 and 60 from Parker Chomerics further optimise heat transfer applications in electronic systems.

The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, is introducing its next generation of thermal gap filler pads – THERM-A-GAPTM PAD 30 and 60 – for all heat transfer applications between electronic components and heat sinks.

Thermal Gap Filler Pads
Parker Chomerics | THERM-A-GAP PAD 60 Thermally Conductive Gap Filler Pads

With a dependable thermal performance of 3.2 W/m-K, the cost-effective THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat generating components. For higher performance applications, THERM-A-GAP PAD 60 offers the enticing combination of excellent thermal conductivity at 6.0 W/m-K, while being 40% softer than current high-performance thermal gap pad offerings from Parker Chomerics.

With their special formulation, THERM-A-GAP PAD 30 and 60 ensure complete conformability (with low clamping forces) and the lowest outgassing, thus providing an effective thermal interface wherever uneven surface irregularities, air gaps or rough textures are prevalent. The products are ideal for use in general industrial, life science and consumer markets. Typical applications extend from telecommunications equipment, automotive electronics, and lighting LEDs, through to power conversion systems, consumer electronics, desktop/laptop computers, servers, handheld devices and memory modules. THERM-A-GAP PAD 30 and 60 are also highly effective in vibration-dampening applications.

Thermal Gap Filler Pads
Parker Chomerics | THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads

Aside from excellent thermal performance, further advantages include ultra-low deflection force and high-tack surfaces to help reduce contact resistance.

Brian Mahoney, Thermal Business Unit Manager at Chomerics Division, said:

“Thermal gap filler pads continue to be designed and used in greater capacities for price-sensitive markets, as well as those requiring high-performance materials. We’re thrilled to expand our already impressive family of thermal gap filler pads with these next-generation offerings”

Manufactured globally, THERM-A-GAP PAD 30 and 60 come in a range of standard sheet sizes and thicknesses, although custom dimensions are available upon request. Parker Chomerics can also supply the products with various carrier options for ease-of-application and use.

About Chomerics

Chomerics is a division of Parker Hannifin Corporation and is part of its Engineered Materials Group. It is the global leader in development and application of electrically and thermally conductive materials in electronics, transportation and alternative energy systems. Click here for more details.

This article was originally published by Parker Hannifin.

Contact Parker Hannifin

Use the form opposite to get in touch with Parker Hannifin directly to discuss any requirements you might have.

    We'd love to send you the latest news and information from the world of Railway-News. Please tick the box if you agree to receive them.

    For your peace of mind here is a link to our Privacy Policy.

    By submitting this form, you consent to allow Railway-News to store and process this information.

    Follow Railway-News on LinkedIn
    Follow Railway-News on Twitter